Huawei and Xiaomi among 90 companies want to build China’s own semiconductor industry

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A group of Ninety Chinese companies has submitted the application to form the National Integrated Circuit Standardization Technical Committee. According to the Ministry of Industry and Information Technology in China, the secretariat is planned to be established in the China Electronics Standardization Institute.

The major names among the 90 companies are Huawei, Shenzhen HiSilicon, Xiaomi, ZTE Microelectronics, SMIC, Datang, Unichip Microelectronics, Zhanrui Communications, China Mobile, China Unicom, China Telecom, and Tencent.

The application adds that the current standardization of the integrated circuits is in charge of the IC sub-committee of SAC/TC78/SC2 National Semiconductor Device Standardization Technical Committee, reported Huawei Central.

According to the application, the committee will focus on the research and formulation of the following standards (as translated from Chinese to English through Google translator):

1- Improve the relevant standards for the assessment of integrated circuit products, including conducting research on the assessment requirements of integrated circuit bare chips and organizing the formulation of relevant standards.

2- Track the development of emerging packaging technologies, focusing on the standardization of high-density FC-BGA packaging, wafer-level 3D rewiring packaging, through silicon via (TSV) packaging, SiP RF packaging, and ultra-thin chip 3D stacked packaging technologies, And solidify the results into assessment procedures and requirements for flip-chip bonding, chip-scale packaging (CSP), wafer-level packaging (WLP), and system-in-package (SiP).

3- Conduct research and standard formulation in response to the performance, reliability and information security requirements of integrated circuit products in emerging applications.

For example, for mobile Internet, cloud computing, Internet of Things, big data, etc., for key integrated circuits with a large amount of supporting and a wide range of applications, such as microprocessors, memories, field-programmable circuits, custom circuits, system-level circuits (SoC and Related IP cores), etc., carry out corresponding standard research and formulation work.

4- Carry out parameter index system and quality assurance element research, formulate blank detailed specifications, so as to provide a basis for the preparation of detailed specifications for integrated circuit products, and ensure that product parameter indicators can fully meet the performance requirements, reliability requirements and information security of integrated circuits in the above application fields Guarantee requirements.

5- Improve the standard system of test methods, mechanical and environmental test methods, and ensure that the test and test of various parameter indicators have standards to be followed.

6- Carry out standard research and formulation of integrated circuit process control, including the analysis of the standardization of collaborative innovation in various links such as integrated circuit design, software development, system integration, content and service around the industrial chain of key areas such as mobile smart terminals and network communications To strengthen the formulation of design assurance standards such as design process quality control requirements and design verification requirements, and to develop in concert with all links of the industrial chain.

7- Strengthen the formulation of process control standards such as process control technology application guidelines, process selection guidelines, process inspection specifications, and solidify to improve the level of integrated circuit manufacturing processes.

8- Combined with the development of advanced packaging technologies (such as high-density three-dimensional system integrated packaging), strengthen the formulation of guiding standards for packaging material evaluation and packaging process evaluation.

In addition, the current international MEMS standards are mainly based on microstructure technology and test methods, and device product specifications are relatively few. However, with the development of technology, there will be more and more standardized requirements for MEMS chip products. After the establishment of the technical committee, It will cater to domestic and foreign needs, rationally layout and plan my country’s MEMS field standard system, and promote the effective connection of my country’s MEMS field standard formulation with the international.

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